Webinar: Solder Joint Endurance Reliability

Recently, various electronic and electrical devices have come to be used in our societies. Under these circumstances, the failure of the equipment gives a great impact on our social life. Printed circuit board(PCB) is an important component of the equipment and has various factors for   failures include heat resistance, wettability, lift-off, ion migration, and power cycle failure,  solder breaks, whiskers, etc.

At the lecture,  solder joint endurance reliability is lectured based on the IEC standard

(IEC 62137-3: 2011, Electronics assembly technology-Part 3: Selection guidance of environmental and endurance test methods for solder joints) . The lecturer explains  the reliability tests on the basic three viewpoints of "stress," "mechanism," and "acceleration coefficient."

As a result, attendees can recognize that the quality and the reliability of electronic and electrical equipment should be fixed at the design stage, and that it is important to build the equipment by firmly assuming the above-mentioned defects.

 

 

  • Electronics
  • Power Electronics
  • Power Systems
  • Power Equipment
  • Electromagnetic Devices
Time

15 Jan 2022

9:00am - 10:00am

Calendar
Add to Calendar 01/15/2022 09:00 01/15/2022 10:00 Webinar: Solder Joint Endurance Reliability Recently, various electronic and electrical devices have come to be used in our societies. Under these circumstances, the failure of the equipment gives a great impact on our social life. Printed circuit board(PCB) is an important component of the equipment and has various factors for failures include heat resistance, wettability, lift-off, ion migration, and power cycle failure, solder breaks, whiskers, etc. At the lecture, solder joint endurance reliability is lectured based on the IEC standard (IEC 62137-3: 2011, Electronics assembly technology-Part 3: Selection guidance of environmental and endurance test methods for solder joints) . The lecturer explains the reliability tests on the basic three viewpoints of "stress," "mechanism," and "acceleration coefficient." As a result, attendees can recognize that the quality and the reliability of electronic and electrical equipment should be fixed at the design stage, and that it is important to build the equipment by firmly assuming the above-mentioned defects. Japan

Organiser

Japan Local Network

Registration Information

Organised by: IET Japan Network

Date: 15th January 2022  (Saturday)

Time:  9:00-10:30 (Japan Standard Time) 

Speaker:  Mr. Ichizo Sakamoto, PE(Professional Engineer) Japan, APEC Engineer, IEC/TC91 WG3 convener, Solder joint specialist

Venue: Online Zoom (After registration, an automated email with Zoom link will be received. Please check your inbox or junk mailbox )

Fees:  Free of charge

Language: English

*Recording of the lecture is strictly prohibited. 

 



Location

Online webinar, Japan

Japan
Tokyo
00000
Japan



Programme

 

 

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